AR
C
HIVE INF
O
RMATI
O
N
A
RCHIVE INFORMATION
2
RF Device Data
Freescale Semiconductor
MRF18085ALR3 MRF18085ALSR3
Table 4. Electrical Characteristics
(TC
=25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Drain--Source Breakdown Voltage
(VGS
=0Vdc,ID
= 100
μAdc)
V(BR)DSS
65
?
?
Vdc
Zero Gate Voltage Drain Current
(VDS
=26Vdc,VGS
=0Vdc)
IDSS
?
?
10
μAdc
Gate--Source Leakage Current
(VGS
=5Vdc,VDS
=0Vdc)
IGSS
?
?
1
μAdc
On Characteristics
Gate Threshold Voltage
(VDS
=10Vdc,ID
= 200
μAdc)
VGS(th)
2
?
4
Vdc
Gate Quiescent Voltage
(VDS
=26Vdc,ID
= 600 mAdc)
VGS(Q)
2.5
3.9
4.5
Vdc
Drain--Source On--Voltage
(VGS
=10Vdc,ID
=2Adc)
VDS(on)
?
0.15
?
Vdc
Dynamic Characteristics
Reverse Transfer Capacitance
(1)
(VDS
=26Vdc,VGS
=0,f=1MHz)
Crss
?
3.6
?
pF
Functional Tests
(In Freescale Test Fixture, 50 ohm system)
Common--Source Amplifier Power Gain @ 85 W
(2)
(VDD
=26Vdc,IDQ
= 800 mA, f = 1805 -- 1880 MHz)
Gps
13.5
15
?
dB
Drain Efficiency @ 85 W
(2)
(VDD
=26Vdc,IDQ
= 800 mA, f = 1805 -- 1880 MHz)
η
48
52
?
%
Input Return Loss @ 85 W
(2)
(VDD
=26Vdc,IDQ
= 800 mA, f = 1805 -- 1880 MHz)
IRL
?
-- 1 2
-- 9
dB
Power Output, 1 dB Compression Point
(VDD
=26Vdc,IDQ
= 800 mA, f = 1805 -- 1880 MHz)
P1dB
83
90
?
Watts
1. Part is internally matched both on input and output.
2. To meet application requirements, Freescale test fixtures have been designed to cover the full GSM1800 band, ensuring
batch--to--batch consistency.